| Growth Method |
VGF |
VGF |
VGF |
VGF |
| Dopant |
Si (N-type) |
Si (N-type) |
Si (N-type) |
Si (N-type) |
| Zn (P-type) |
Zn (P-type) |
Zn (P-type) |
Zn (P-type) |
| Wafer Shape |
2" |
3" |
4" |
6" |
| Diameter (mm) |
50.8+/-0.3 |
76.2+/-0.3 |
100+/-0.3 |
150+/-0.3 |
| Surface Orientation |
(100)+/-0.5 deg. |
(100)+/-0.5 deg. |
(100)+/-0.5 deg. |
(100)+/-0.5 deg. |
| Carrier Concentration(cm-3) |
(0.8-~4)E18 (N-type) |
(0.8-~4)E18 (N-type) |
(0.8-~4)E18 (N-type) |
(0.8-~4)E18 (N-type) |
| (0.5~5)E19 (P-type) |
(0.5~5)E19 (P-type) |
(0.5~5)E19 (P-type) |
(0.5~5)E19 (P-type) |
| Mobility (cm2/V.S.) |
(1~2.5)E3 (N-type) |
(1~2.5)E3 (N-type) |
(1~2.5)E3 (N-type) |
(1~2.5)E3 (N-type) |
| (50~120) (P-type) |
(50~120) (P-type) |
(50~120) (P-type) |
(50~120) (P-type) |
| Etch Pitch Density(cm2) |
(100~5000) (N-type) |
(100~5000) (N-type) |
(100~5000) (N-type) |
(100~5000) (N-type) |
| (3000~5000) (P-type) |
(3000~5000) (P-type) |
(3000~5000) (P-type) |
(3000~5000) (P-type) |
| Thickness (um) |
350+/-25 |
625+/-25 |
625+/-25 |
675+/-25 |
| TTV (P/P) (um) |
≦4 |
≦4 |
≦4 |
≦4 |
| TTV (P/E) (um) |
≦10 |
≦10 |
≦10 |
≦10 |
| WARP (um) |
≦10 |
≦10 |
≦10 |
≦10 |
| OF (mm) |
17+/1 |
22+/-1 |
32.5+/-1 |
Notch |
| OF / IF (mm) |
7+/-1 |
12+/-1 |
18+/-1 |
NONE |
| Polish |
E/E, P/E, P/P |
E/E, P/E, P/P |
E/E, P/E, P/P |
E/E, P/E, P/P |
| Laser Mark(front side/ back side) |
Customization |
Customization |
Customization |
Customization |
| Remark |
*E=Etched, P=Polished |
|
